Metallization of dielectrics
US7780771B2 · kind B2 · utility
2Cited by
27References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2006 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Jun 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition and method are disclosed. The composition both conditions and activates a dielectric material for metal deposition. The metal may be deposited on the dielectric by electroless methods. The metallized dielectric may be used in electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.