Container for precision substrate
US7781035B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 28, 2002 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Jan 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A container for precision substrate having one or more component formed by molding a thermoplastic resin, characterized in that the component satisfies characteristics [1] and [2] below. [1] When being brought to contact ultra high purity argon gas (impurity concentration: 1 ppb or less) at 25° C. having a flow rate of 1.2 L/min., a water amount in said argon gas after 300 minutes is 30 ppb or less per a surface area 1 cm2 of the component. [2] When being placed in the air at 100° C., an increase amount of organics in the air in 300 minutes is 150 ng or less per weight 1 g of the component. According to the container, demands for low contamination can be satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.