Semiconductor die singulation method
US7781310B2 · kind B2 · utility
53Cited by
8References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2007 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Aug 7, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0333
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.