Electronic package with a thermal interposer and method of manufacturing the same
US7781883B2 · kind B2 · utility
69Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2008 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Sep 27, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal interposer having an area extending beyond a footprint of the die, the area including the thermal interface material, the thermal interposer conducting heat generated by the die through the thermal interface material such that an auxiliary heat flux path for conducting heat generated in the die is enabled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.