Patent · US Active

Electronic chip contact structure

US7781886B2 · kind B2 · utility

11Cited by

176References

24Claims

0Family size

Inventors

John Trezza · Nashua, US
John Callahan · Wilmington, US
Gregory Dudoff · Phoenix, US

Key dates

Filing date	Jan 10, 2006
Grant date	Aug 24, 2010
Priority date	—
Expiry date	Aug 28, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip contact functionally having an IC pad, a barrier layer over the IC pad, and a malleable material over the barrier layer. An alternative chip contact functionally having an IC pad, a barrier layer over the IC pad, and a rigid material over the barrier layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.