Reducing contamination in immersion lithography
US7782445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2008 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Feb 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A wafer chuck assembly includes a first chuck section configured to hold a semiconductor wafer on a support surface thereof, and a second chuck section removably attached to the first chuck section. The first chuck section has a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein. A fluid circulation path is configured within the first chuck section so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.