Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material
US7784764B2 · kind B2 · utility
0Cited by
17References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 1, 2005 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Nov 1, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1259
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.