Adhesive film for circuit connection, and circuit connection structure
US7785708B2 · kind B2 · utility
7Cited by
18References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2005 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jan 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.