Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film
US7785766B2 · kind B2 · utility
22Cited by
8References
4Claims
0Family size
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Key dates
| Filing date | Jan 30, 2008 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Mar 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photo-curable resin composition comprising a silphenylene-bearing polymer having a Mw of 3,000-500,000 can be processed to form patterned films having a widely varying thickness from submicron to more than 20 μm. The cured films have good adhesion to substrates, heat resistance, electrical insulation and chemical resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.