System and method for forming moveable features on a composite substrate
US7785913B2 · kind B2 · utility
7Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2006 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Sep 24, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0132
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for forming moveable features suspended over a substrate is described, wherein a cavity beneath the moveable feature is first formed using a liquid etchant applied through one or more release holes. After formation of the cavity, the outline of the moveable feature is formed using a dry etch process. Since the moveable feature is free to move upon its formation using the dry etch process, no stiction issues arise using the systems and methods described here.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.