Resin composition and application thereof
US7786029B2 · kind B2 · utility
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1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2009 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jan 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2992
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.