Solid-state curved focal plane arrays
US7786421B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2004 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Aug 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/80
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to curved focal plane arrays. More specifically, the present invention relates to a system and method for making solid-state curved focal plane arrays from standard and high-purity devices that may be matched to a given optical system. There are two ways to make a curved focal plane arrays starting with the fully fabricated device. One way, is to thin the device and conform it to a curvature. A second way, is to back-illuminate a thick device without making a thinned membrane. The thick device is a special class of devices; for example devices fabricated with high purity silicon. One surface of the device (the non VLSI fabricated surface, also referred to as the back surface) can be polished to form a curved surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.