QFN Semiconductor package
US7786557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2009 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Feb 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quad flat non-lead (QFN) semiconductor package includes a die attach pad having a recessed area; a semiconductor die mounted inside the recessed area of the die attach pad; at least one row of inner terminal leads disposed adjacent to the die attach pad; first wires bonding respective said inner terminal leads to the semiconductor die; at least one row of extended, outer terminal leads disposed along periphery of the QFN semiconductor package; at least one row of intermediary terminals disposed between the inner terminal leads and the extended, outer terminal leads; second wires bonding respective the intermediary terminals to the semiconductor die; and third wires bonding respective the intermediary terminals to the extended, outer terminal leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.