Heat-conductive package structure
US7786571B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2008 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jan 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09627
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-conductive package structure includes a carrier board having a first surface and an opposing second surface and formed with a through opening passing the carrier board; a first heat-conductive structure including a heat-conductive hole in the through opening, a first heat-conductive sheet on the carrier board, and a second heat-conductive sheet on the carrier board, wherein the first and second heat-conductive sheets are conductively connected by the heat-conductive hole; a first dielectric layer formed on the first surface of the carrier board and formed with a first opening for exposing the first heat-conductive sheet; a second dielectric layer formed on the second surface of the carrier board and formed with at least a second opening for exposing a portion of the second heat-conductive sheet; and a second heat-conductive structure formed in the second opening and mounted on the second heat-conductive sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.