Apparatus and method for reducing contamination in immersion lithography
US7787101B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 16, 2006 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Feb 25, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/707
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus for reducing contamination in immersion lithography includes a wafer chuck assembly including a wafer chuck configured to hold a semiconductor wafer on a support surface thereof. An O-ring assembly has a deformable O-ring attached to movable support sections arranged in a generally circular configuration so as to surround the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.