Processing apparatus and method
US7789647B2 · kind B2 · utility
5Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2005 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jan 3, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, and an irradiation of light for exposing the resist onto the resist includes a mold chuck for holding the mold and for compressing the mold against the resist, and a deformation reducing part for reducing a deformation of the mold when the mold chuck applies a compression force to the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.