Methods and apparatus for cleaning chamber components
US7789969B2 · kind B2 · utility
3Cited by
78References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Oct 31, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4407
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In a first aspect, a method for cleaning a semiconductor fabrication chamber component having an orifice is provided. The method includes (A) placing the component into a bath having a cleaning solution; (B) flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; and (C) withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice. Numerous other aspects are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.