Method for manufacturing rigid-flexible printed circuit board
US7789989B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
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Key dates
| Filing date | Nov 13, 2008 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Nov 13, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.