Method of manufacturing flexible semiconductor assemblies
US7790502B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 10, 2007 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Feb 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing flexible semiconductor assemblies is described. For example, an integrated circuit package consisting of an X-Y axes sensor die and a Z-axis sensor die disposed at 90 degrees to each other may be formed by applying a flexible dielectric membrane to a semiconductor wafer, creating bending gaps between the sensor dice, singulating the IC package from the wafer, and bending the flexible dielectric membrane so that the sensor dice are disposed orthogonally to each other. This method eliminates the need to precisely position previously singulated sensor dice relative to each other in order to apply a flexible dielectric membrane for purposes of interconnecting the dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.