David Scheid
7Patents
5h-index
4Co-inventors
52Inventor score
Filing activity: Mar 8, 2004 → Nov 5, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8362607B2 | Integrated circuit package including a thermally and electrically conductive package lid | Electricity | 20 | Active |
| US8354743B2 | Multi-tiered integrated circuit package | Electricity | 14 | Active |
| US7067352B1 | Vertical integrated package apparatus and method | Electricity | 11 | Expired |
| US7979746B2 | Dual-dual lockstep processor assemblies and modules | Emerging Cross-Sectional Technologies | 6 | Active |
| US7790502B2 | Method of manufacturing flexible semiconductor assemblies | Electricity | 6 | Active |
| US9808831B2 | Automatic shaker screen cleaner | Performing Operations; Transporting | 0 | Active |
| US8907482B2 | Integrated circuit package including wire bond and electrically conductive adhesive electrical connections | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.