Method for fine-pitch, low stress flip-chip interconnect
US7790509B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2008 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Mar 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Attaching a semiconductor chip to a substrate by applying mechanical vibrations (150) to a polymeric compound (130) and the contacting areas (114, 124) of a first (113) and a second (121) metallic member immersed in the compound, while the two metallic members approach (140) each other until they touch. The mechanical vibration causes displacements of the first member relative to the second member, and the vibration includes displacements (150) oriented at right angles to the direction (140) of the approach. The polymeric compound (130) includes a non-conductive adhesive resin paste (NCP) and filler particles; the paste is deposited before the attaching step. The first member (113) is affixed to the chip and the second member (121) to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.