Solder cap application process on copper bump using solder powder film
US7790597B2 · kind B2 · utility
5Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2008 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jun 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0425
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method used during the formation of a semiconductor device assembly can include contacting an end of a conductive bump (which can be a pillar, ball, pad, post, stud, or lead as well as other types of bumps) with a conductive powder such as a solder powder to adhere the conductive powder to the end of the bump. The powder can be flowed, for example by heating, to distribute it across the end of the bump. The flowed powder can be placed in contact with a conductive pad of a receiving substrate and can then be reflowed to facilitate electrical connection between the bump and the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.