Electronic component packaging
US7790615B2 · kind B2 · utility
1Cited by
9References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 21, 2006 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Apr 30, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention relates to a method to seal a cavity, comprising a hole (6), comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.