Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus
US7791001B2 · kind B2 · utility
2Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2005 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jul 8, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
At least one exemplary embodiment is directed to a laser processing apparatus that can use the shape of a plurality of reflected light fluxes to adjust the position of workpiece relative to an optical system, where the laser processing apparatus facilitates both the viewing of the workpiece and a focusing of a processing laser into the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.