Wafer center finding
US7792350B2 · kind B2 · utility
62Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2007 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jul 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.