Defect review using image segmentation
US7792351B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2010 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Feb 22, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
One embodiment pertains to a method for reviewing a potential defect on a substrate from one electron image. An image of an area containing the potential defect is obtained using a charged-particle apparatus. At least three image segments within the image are determined. The three segments are transformably identical to each other, and one of said three segments includes the potential defect. Another embodiment pertains to a method for reviewing a potential defect on a substrate by obtaining an electron-beam image of a relatively large field of view containing a first image segment. The first image segment is substantially smaller than the field of view and includes a location of the potential defect. A comparison image segment within the field of view is determined. The comparison image segment is transformably identical to the first image segment. Other embodiments and features are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.