Apparatus for transferring semiconductor chip
US7793408B2 · kind B2 · utility
5Cited by
5References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 12, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Jun 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.