Patent · US Active

Sensor device including two sensors embedded in a mold material

US7793550B2 · kind B2 · utility

17Cited by

1References

28Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Elian · Alteglofsheim, DE
Albert Auburger · Regenstauf, DE

Key dates

Filing date	Aug 25, 2008
Grant date	Sep 14, 2010
Priority date	—
Expiry date	Oct 16, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable. A second sensor has a second sensor surface. The second sensor surface is sealed to inhibit sensing of the first variable, and a mold material is embedded the first and second sensors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.