Method and device for sawing a workpiece
US7793647B2 · kind B2 · utility
7Cited by
11References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Dec 18, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device suitable for sawing a workpiece, contains a wire web formed by a sawing wire or adapted to receive such a wire web, a forward feed instrument holding a semiconductor workpiece to be sawed and feeding the workpiece in the direction of the wire web, and a reservoir filled with a sawing suspension, the reservoir being arranged and filled such that at least the part of the sawing wire which is in engagement during the sawing process is immersed into the sawing suspension of the reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.