Patent · US Active

Wafer cutting methods and packages using dice derived therefrom

US7795116B2 · kind B2 · utility

1Cited by

4References

27Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Mark Dydyk · Cave Creek, US
Erasenthiran Poonjolai · Chandler, US

Key dates

Filing date	Sep 29, 2008
Grant date	Sep 14, 2010
Priority date	—
Expiry date	Sep 29, 2028

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A wafer-cutting process includes first cutting a semiconductive wafer along a first path at a given first cutting intensity including cutting across an intersection. The process also includes second cutting the semiconductive wafer along a second path at a given second cutting intensity. The second cutting intensity is diminished during crossing the intersection and resumed to the given cutting intensity after crossing the intersection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.