Mark Dydyk
2Patents
1h-index
4Co-inventors
27Inventor score
Filing activity: Sep 29, 2008 → Dec 15, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8222118B2 | Wafer backside grinding with stress relief | Electricity | 7 | Active |
| US7795116B2 | Wafer cutting methods and packages using dice derived therefrom | Performing Operations; Transporting | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.