Method for producing a layer arrangement

US7795135B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stefan Eckert · Dresden, DE
• Klaus Goller · Dresden, DE
• Hermann Wendt · Grasbrunn, DE

Key dates

• Filing date: Dec 14, 2006
• Grant date: Sep 14, 2010
• Expiry date: Oct 10, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76834
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a method for producing a layer arrangement. An electrically conductive layer is formed and patterned. A sacrificial layer formed on at least part of the patterned electrically conductive layer. An electrically insulating layer is formed on the electrically conductive and sacrificial layers and is patterned in such a manner that one or more surface areas of the sacrificial layer are exposed. The exposed areas of the sacrificial layer are removed to expose one or more surface areas of the patterned electrically conductive layer. The patterned electrically conductive layer is covered with a pattern of electrically conductive material.