Low application temperature hot melt adhesive
US7795336B2 · kind B2 · utility
13Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2002 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Oct 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2746
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.