Integrated microphone
US7795695B2 · kind B2 · utility
115Cited by
63References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2006 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Apr 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the die after depositing the deposition material. The circuitry is configured to detect the variable capacitance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.