Capped sensor

US7795723B2 · kind B2 · utility

Assignee

• Analog Devices, Inc. · US

Inventors

• Kevin Chau · Franklin, US
• Lawrence E. Felton · Hopkinton, US
• John A. Geen · Tewksbury, US
• Michael Judy · Ipswich, US
• John R. Martin · Foxborough, US

Key dates

• Filing date: Jan 20, 2005
• Grant date: Sep 14, 2010
• Expiry date: Dec 14, 2028

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/019
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A sensor element is capped by bonding or otherwise forming a cap on a sensor element. The sensor may be hermetically sealed by using a hermetic cap and hermetic bonding material or by applying a hermetic coating. The sensor may be filled with a gas at an elevated pressure. The sensor may alternatively or additionally be filled with a special gas, such as a gas having a density-to-viscosity ratio above approximately 0.2.