Electronic component mounting method
US7797822B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2006 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Dec 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component mounting method of thermo-compressing and mounting electronic components onto a plurality of unit boards segmented in a multi-piece board which avoids the occurrence of adverse thermal influences on the thermosetting bonding material which is placed on the unit boards before mounting the electronic components. The thermo-compression tool used in the method is removably fitted on a thermo-compression head in an electronic component mounting apparatus; the thermo-compression tool includes a base member and a suck-up member which is smaller than a lower surface of the base member and which is fixed on the lower surface of the base member at a position displaced from a center thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.