Method of diffusion bonding a fluid flow apparatus
US7798388B2 · kind B2 · utility
19Cited by
57References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2007 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Sep 13, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/021
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.