Patent · US Expired

Sputtering cathode and device and method for coating a substrate with several layers

US7799179B2 · kind B2 · utility

16Cited by
20References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 18, 2003
Grant dateSep 21, 2010
Priority date
Expiry dateJul 22, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/3405
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a sputtering cathode (1) for coating a substrate (6), which comprises a device (5) for generating an external magnetic field with substantially parallel magnetic field lines (8) substantially in the plane of the substrate. The invention further relates to a device and a method for coating a substrate with several layers, whereby several sputtering cathodes are disposed in a circle with their target effective areas pointing radially outward.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.