Sputtering cathode and device and method for coating a substrate with several layers
US7799179B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2003 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Jul 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a sputtering cathode (1) for coating a substrate (6), which comprises a device (5) for generating an external magnetic field with substantially parallel magnetic field lines (8) substantially in the plane of the substrate. The invention further relates to a device and a method for coating a substrate with several layers, whereby several sputtering cathodes are disposed in a circle with their target effective areas pointing radially outward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.