Patent · US Active

System for separation of an electrically conductive connection

US7799583B2 · kind B2 · utility

1Cited by

10References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Günther Ruhl · Dorfen, DE
Markus Hammer · Neu-Ulm, DE
Regina Kainzbauer · Neukirchen, DE

Key dates

Filing date	Oct 5, 2006
Grant date	Sep 21, 2010
Priority date	—
Expiry date	Oct 9, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the at least one interconnect; and at least one opening through the insulating layer which interrupts the at least one interconnect into a first section and a second section.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.