Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same
US7799586B2 · kind B2 · utility
27Cited by
56References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2009 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Mar 21, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
Abstract
Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.