Method for mounting electronic component on printed circuit board
US7799603B2 · kind B2 · utility
3Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2009 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | May 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.