Integrated circuit module and method of forming the same
US7799605B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2007 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Jan 14, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an integrated circuit module may include interposing an auxiliary PCB between at least one semiconductor chip and a main PCB, the auxiliary PCB having at least one circuit pattern for electrical connection to one of the semiconductor chip and at least one circuit pattern formed on the main PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.