Jea-Eun Lee
7Patents
2h-index
9Co-inventors
40Inventor score
Filing activity: Jul 26, 2007 → Feb 11, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9082464B2 | Memory module for high-speed operations | Electricity | 10 | Active |
| US7540743B2 | Memory module, memory module socket and mainboard using same | Electricity | 4 | Active |
| US8559241B2 | Data receiver, semiconductor device and memory device including the same | Physics | 2 | Active |
| US7859879B2 | Memory module | Physics | 2 | Active |
| US10887980B2 | Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board | Electricity | 0 | Active |
| US7799605B2 | Integrated circuit module and method of forming the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US10561013B2 | Coupled via structure, circuit board having the coupled via structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.