Quad flat pack (QFP) package and flexible power distribution method therefor
US7800205B2 · kind B2 · utility
0Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2005 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Sep 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A Quad Flat Pack (QFP) package which includes first and second dies arranged in a side-by-side orientation, and a power supply bus which protrudes between adjacent sides of the first and second dies and which supplies power to the adjacent sides via connections to the adjacent sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.