Solder preform and electronic component
US7800230B2 · kind B2 · utility
7Cited by
2References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 26, 2007 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Apr 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0415
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.