Infrared interferometric-spatial-phase imaging using backside wafer marks
US7800761B2 · kind B2 · utility
1Cited by
12References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2007 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Oct 28, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7088
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An interferometric-spatial-phase imaging (ISPI) system includes a substrate wafer. An alignment configuration is permanently embedded in the substrate wafer. The alignment configuration uses a global coordinate reference system by providing a plurality of global reference marks that encompass up to the entire substrate wafer. A plurality of alignment markings is provided on a surface in close proximity to the alignment configuration for obtaining continuous six-axis control of a scanning probe tip with respect to the global coordinate reference system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.