Current-leveling electroplating/electropolishing electrode
US7803257B2 · kind B2 · utility
5Cited by
3References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2004 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Jun 14, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53204
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.