Method for manufacturing a molded MMC multi media card package obtained with laser cutting
US7803663B2 · kind B2 · utility
1Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Oct 22, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/041
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.