Bowed wafer hybridization compensation
US7803693B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Feb 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A planarizing method performed on a non-planar wafer involves forming electrically conductive posts extending through a removable material, each of the posts having a length such that a top of each post is located above a plane defining a point of maximum deviation for the wafer, concurrently smoothing the material and posts so as to form a substantially planar surface, and removing the material. An apparatus includes a non planar wafer having contacts thereon, the wafer having a deviation from planar by an amount that is greater than a height of at least one contact on the wafer, and a set of electrically conductive posts extending away from a surface of the wafer, the posts each having a distal end, the distal ends of the posts collectively defining a substantially flat plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.