Patent · US Active

Semiconductor component with surface mountable devices and method for producing the same

US7804178B2 · kind B2 · utility

0Cited by

12References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Erich Syri · Wenzenbach, DE
Gerold Gruendler · Regensburg, DE
Juergen Hoegerl · Regensburg, DE
Thomas Killer · Hohenschambach, DE
Volker Strutz · Tegernheim, DE

Key dates

Filing date	May 14, 2007
Grant date	Sep 28, 2010
Priority date	—
Expiry date	Aug 29, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.